| PCB technical capacity parameter |
| Item |
Mass processing capability |
Small batch processing capability |
| Layer (Max.) |
1-40 |
40 |
| Type of the board material |
FR-4, Aluminum base, Copper base, Steel base, High TG, Rogers, PI, PET,etc. |
| Maximum Size |
505mm x 800mm |
610mm x 1100mm |
| Outline Size Tolerance |
±0.13mm |
±0.10mm |
| V-CUT Deepness Tolerance |
+/- 0.15 mm (V-CUT) ：+/- 0.1 mm (CNC V-CUT) |
| Board Thickness Range |
0.2mm--6.0mm |
6.0mm--8.0mm |
| Board Thickness Tolerance |
±10% |
±10% |
| Medium Thickness(Min) |
0.065(RCC65T) |
0.05mm |
| Minimum Line Width |
0.075mm（3mil） |
0.063mm(2.5mil) |
| Minimum Line Space |
0.075mm（3mil） |
0.063mm(2.5mil) |
| Line Margin |
0.2 mm（CNC） ：0.30 mm (punch)：0.50 mm (V-CUT) |
| Inner layer / Outer layer copper thickness |
9um--140um |
175um--210um |
| Drill hole size (mechanical hole) |
0.15mm--6.0mm |
0.15mm--6.0mm |
| Hole size tolerance (mechanical hole) |
+/- 0.076 mm (normal hole): +/- 0.05 mm (NPTH): +0.1/-0.05 mm (punch hole) |
| Laser hole size |
0.1mm |
0.075mm |
| Solder mask type |
sensitive green, yellow, black, MATT, blue, red ink,and peelable blue glue. |
| Minimum width of solder mask bridge |
0.10mm |
0.075mm |
| Soldermask oil plug hole diameter |
0.25mm--0.60mm |
0.60mm-0.70mm |
| Impedance tolerance |
±10% (impedance>50ohm) ；±5%(impedance<50ohm) |
±5% (impedance>50ohm) |
| Surface processing type |
Plating nickel gold(soft gold/flash gold), thick & hard gold, chemical nickel gold,immersion tin,lead-free H.A.S.L, Entek,gold-finger,and selective surface processing. |
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